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May 24, 2023 | Purdue University College of Engineering News

From micro to macro: cooling data centers from the inside out.

In the U.S., data centers account for approximately 2% of total electricity consumption; a large percentage of that is for cooling high-performance microchips. Purdue University researchers have received a $1.9 million grant from the U.S. Department of Energy to develop cooling systems for these microchips, making data centers more efficient and saving energy that will help mitigate climate change.
May 9, 2023

US Department of Energy announces $40 M for more efficient cooling for Data Centers

WASHINGTON, D.C. — The U.S. Department of Energy (DOE) today announced $40 million in funding for 15 projects that will develop high-performance, energy efficient cooling solutions for data centers. Used to house computers, storage systems, and computing infrastructure, data centers account for approximately 2% of total U.S. electricity consumption while data center cooling can account for up to 40% of data center energy usage overall.
May 3, 2023

US-Europe semiconductors collaboration milestone as Purdue-imec announce partnership

Purdue University and the state of Indiana continue to make giant leaps in semiconductor research growth with a first-of-its-kind agreement with a cutting-edge European nano- and digital technology innovation hub. Imec joined Indiana Gov. Eric Holcomb, U.S. Sen. Todd Young, Indiana Secretary of Commerce Brad Chambers and Purdue University President Mung Chiang in announcing the partnership during the SelectUSA Investment Summit, an annual international investment event by the U.S. Department of Commerce near Washington, D.C.