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May 10, 2024 | Purdue Newsroom

Purdue, Dassault Systèmes, Lam Research sign MOU to utilize latest virtual twin technology to transform semiconductor research and workforce development

Purdue University is taking semiconductor workforce development and research to new levels with the signing of a three-way agreement with industry leaders Lam Research and Dassault Systèmes focused on training today’s students for future semiconductor careers and forging next-generation breakthroughs in education and technology development.

May 9, 2024 | Purdue Newsroom

NSF director Panchanathan, U.S. Sen. Young tout value of university-private sector partnerships to grow national, economic security

Purdue University and national leaders celebrate plans for $100 million worth of renovations at Birck Nanotechnology Center and its Scifres Nanofabrication Laboratory, or cleanroom, in Discovery Park District at Purdue.

April 16, 2024 | Purdue Engineering

Purdue to host CHIPS summit in Washington DC

April 16, 2024 | Purdue Newsroom

SK hynix announces semiconductor advanced packaging investment in Purdue Research Park

February 26, 2024 | Purdue Research

Birck supports new Purdue-Dassault Systèmes partnership in developing virtual twin technology to enhance semiconductor education and research

February 1, 2024 | Laser Focus World

Spinning meta-optics for spectro-polarimetric thermal imaging?

Purdue University researchers merge optical engineering with cutting-edge computational imaging techniques—a spinning metasurface stack breaks thermal light down into its spectral and polarimetric components.

January 29, 2024 | Birck

Jan 31 Open House to Showcase Birck Nanotech’s New Vision

The Birck Nanotechnology Center, Purdue’s flagship home for advanced research and development at the atomic scale, will host an open house for the Purdue research community this Wednesday, Jan. 31, from 2-4 p.m.

December 11, 2023 | Purdue News

European technology leader imec opens innovation hub at Purdue

Partnership with Belgium-based imec further strengthens Purdue’s capability as leading university in U.S. microelectronics R&D.

December 5, 2023 | Purdue News

Purdue’s new institute for advanced system integration and packaging honors Boilermaker and innovative visionary in semiconductors

Engineering alumnus’ discovery laid the foundation for advanced packaging, system integration research.

October 19, 2023 | Purdue News

New institute accelerates future of microelectronic system integration, advanced packaging

Purdue collaborates with Cadence, imec, SRC, Osaka University to bolster rapid technology development in U.S.

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