Purdue, Dassault Systèmes, Lam Research sign MOU to utilize latest virtual twin technology to transform semiconductor research and workforce development
NSF director Panchanathan, U.S. Sen. Young tout value of university-private sector partnerships to grow national, economic security
Purdue to host CHIPS summit in Washington DC
SK hynix announces semiconductor advanced packaging investment in Purdue Research Park
Birck supports new Purdue-Dassault Systèmes partnership in developing virtual twin technology to enhance semiconductor education and research
Spinning meta-optics for spectro-polarimetric thermal imaging?
Jan 31 Open House to Showcase Birck Nanotech’s New Vision
Purdue’s new institute for advanced system integration and packaging honors Boilermaker and innovative visionary in semiconductors
New institute accelerates future of microelectronic system integration, advanced packaging