Purdue, Dassault Systèmes, Lam Research sign MOU to utilize latest virtual twin technology to transform semiconductor research and workforce development
Purdue to host CHIPS summit in Washington DC
SK hynix announces semiconductor advanced packaging investment in Purdue Research Park
Birck supports new Purdue-Dassault Systèmes partnership in developing virtual twin technology to enhance semiconductor education and research
Spinning meta-optics for spectro-polarimetric thermal imaging?
Jan 31 Open House to Showcase Birck Nanotech’s New Vision
European technology leader imec opens innovation hub at Purdue
Purdue’s new institute for advanced system integration and packaging honors Boilermaker and innovative visionary in semiconductors
New institute accelerates future of microelectronic system integration, advanced packaging